ZnS vs Titania for high Refractive Index coatings
** Question **
We currently metallise PET with aluminium. We are considering retro-fitting our coater so we can manufacture HRI products.
Firstly, what are the pros and cons of zinc suplide compared to titanium dioxide (or any other alternatives you suggest we consider).
Second, do we need a plasma treater ? We have heard conflicting information - some stating a plasma treater is essential and some stating it isn't. Please help.
** Answer **
Zinc Sulphide tends to be a soft porous coating but can be deposited at metallizing speeds (100's m/min). The ZnS can be thermally evaporated from a slot source that spans the whole web width. This ease of deposition means that the cost of ZnS is much lower than for depositing titania. The ZnS can dissociate and recombine easily and so stoichiometry is generally not an issue. Operators may not be so happy with the material as it can smell when the system is vented because of the residual Sulphur.
Titania tends to be denser, harder and is usually deposited by slower techniques ( 1 - 10's m/min). If you are after a hard wearing, highest quality hologram then titania will probably be the preferred material.
Many companies using the coating for holograms want to deposit the coating and emboss later. It is possible to emboss into the polymer through the ZnS and still get a good hologram. The ZnS is soft and deformable but it is a test of how good the adhesion is between the ZnS and substrate. ZnS has the advantage that it does less wear on the holographic shims than the harder titania and so production costs can be further reduced.
Part of the problem of depositing titania is getting the stoichiometry right. Sputtering from a titanium target and reacting the coating with oxygen to produce titania is not neceaasrily easy. The oxygen cannot be controlled selectively to reach the growing coating and not the sputtering cathode & so the cathode gets poisoned. The sputtering rate of titania is 20x slower than for the metal and so the process tends to avalanche to sputtering slowly from an oxide target. There are methods of correcting for this runaway process but they all push up the deposition costs. Ideally if the coating is to be deposited by sputtering a dual cathode with an AC power supply including arc control would be preferred. One system built a few years ago used a sputtering source with an additional oxygen ion gun to control the oxygen input to a minimum excess. This system operated at around 2 m/min winding speed.
It is possible to deposit titania from electron beam deposition sources but getting a consistent stoichiometry is not trivial. Often an additional oxygen plasma is used both to densify the coating to make it more like a sputtered coating but also as a method of reducing the excess oxygen that is required to convert the metal to titania.
Uniformity can also be an issue. Sputtering has a deposition rate fall off towards the ends of the cathode so that to get high uniformity across the whole web width requires a cathode length wider than the web width. For electron beam sources it depends if you have a series of individual sources that have their deposition flux integrated across the width or if there is a single sweeping electron beam with a single crucible that spans the web width.
Critical to both will be the position of the pumping system in the system you are planning to convert and the method of feeding in the oxygen gas. Ideally the pumping will be symmetric about the web centreline (including any cryopumps) if this is not the case there are additional problems if achieving uniformity. Moisture from the webs can be a source of oxygen to the coating as well as the oxygen supplied to the plasma as the controlled gas source. If there is asymmetric pumping then there will be a pressure gradient across the web and it then becomes difficult to deliver sufficient oxygen, an no more, to all parts of the sputtering cathode or vapour flux from the e-beam source. Any imbalance will lead to non-stoichiometric coatings.
Plasma cleaning. There are many different plasma cleaning sources available. Some work better than others. The choice of power, time and gas composition can all affect the effectiveness of any plasma treatment. In general it is better to plasma clean than not. Most polymer film has contamination on the surface. This contamination is a source of poor adhesion. It either needs to be better bound into the polymer web or volatilised and pumped away leaving behind the polymer web surface. If the surface is under treated there the adhesion will not be optimised. If the surface is over treated it may still have a high surface energy but it will also have a weak boundary layer on the surface caused by too much polymer chain scission by the over treatment. Thus plasma treatment is a balance that has to be optimised for each polymer film. Changing supplier can be it is best to re-optimise as different film suppliers will use different proprietary formulations and so the surfaces may well be different.
Argon plasma can roughen the surface and sputter efficiently but there is no mechanism for converting any hydrocarbons into gaseous species that can be pumped away and so what ever is sputtered from the surface may well fall back and still be a contaminant to the surface even though it has been plasma treated. Thus using an oxygen/argon plasma is probably the most favoured plasma treatment gas mixture for the widest range of polymer webs. There are exceptions and sometimes a different bonding site is required that makes oxygen less favoured.
My advice would always to be to keep the process as simple as possible. Hence do not plasma treat if you do not have to. Thus I would do some trials first to check if the adhesion of the coating is good enough i.e. fit-for-purpose.
For ZnS my expectation is that the adhesion will be a problem if you do not use any plasma treatment. I would expect a plasma treatment to be a critical part of the process.
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if you elect to go with titania then it may be much less critical, depending on the process you adopt. If you are using an oxygen additional plasma this may aid your adhesion, if you are using a sputtering source this will already be bombarding your substrate to some extent and will have a better adhesion than from an evaporation source.
I think this just about answers your question as far as I can. The choices will depend on the substrate material, the system you are wanting to convert, the cost you have to produce the coating coupled to the performance of the coating.


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