The initial question was we think we have a problem of backstreaming, what might be the cause?
Following the first answer the problem was elaborated on and so the second answer was produced.
We have vacuum coating unit for aluminisation of Kapton films by physical vapour deposition. Two numbers of films of 25 microns thickness is pasted on the walls of the chamber and aluminium foils are loaded on the bus bar with tungsten filaments which is introduced in between the films. It consists of a rotary pump, rootes pump and diffusion pump and the vacuum level is 10-5 Torr. The plant is 10 years old. First step is roughing followed by backing again roughing and then high tension plasma treatment for cleaning for 15 minutes. Then diffusion pump is switched on with high vacuum and finally vaporizing aluminium by applying low tension for 30 seconds. Now the problem is aluminium from the top most portion of the Kapton film in semi circle with some I foot diameter where the vacuum duct is coming, actual size is 2.5m x 2m, is peeling off on tape peel test. We have changed all oils, cleaned all internal parts possible and still the problem is there.
1st ANSWER
There can be a few causes of oil backstreaming. One is that the roughing pump has stopped working as efficiently as previously. In this case it is worth checking the oil level and also the water content of the oil, it may be that the rotary pump needs to be ballasted. If the oil in the rotary pump looks to be a milky and opaque it needs to be ballasted to raise the temperature and encourage the water to be evaporated out of the oil. If you have changed the oil this would solve this problem, unless you have an internal water leak that is contaminating the rotary pump oil rapidly. So even after changing the oil it is worth checking the colour of the oil and making sure it remains a transparent liquid of a light straw colour.
The other common problem is that the system has been left pumping for a prolonged period of time at the base pressure of the system. It is often believed that the best way to remove the water from a vacuum system is to pump down to a very low base pressure. This is not so. Water is removed from the surface by gas bombardment or some other technique for adding some energy such as heat or ultra-violet light. What was found in the semi-conductor industry was that it was better to feed gas in at quite a high vacuum pressure and restricts the falling pressure so that the gas bombardment of the surfaces is maintained. This has proved to be more effective at removing the water. This larger gas flow makes it harder for the diffusion pump to start backstreaming because of the continued gas load.
Another common problem is that the backing pump does not pump the vacuum vessel down far enough to safely change to the diffusion pump and the diffusion pump stalls as the gas pressure in the diffusion pump rises so high that the oil vapour collides with so much gas that it never reaches the cooled walls to condense and drain back down to the heater of the diffusion pump to be re-vaporised. Instead the oil vapour collides and is redirected up into the vacuum system.
I would suggest a close review of the system including how the system is operated paying particular attention to the order and pressures used for the opening of valves and switching pumps.
2nd ANSWER – following the additional information.
Going back to the problem and working through the possibilities.
The starting point with any problem is to firstly check that we are trying to solve the right problem.
Firstly I would check that the failure is really at the interface and no a cohesive failure within the substrate. This is unlikely but it is worth checking as if the failure is cohesive then we could spend months trying to solve the wrong problem.
If you have access to surface analytical machines then checking a fresh failure to see what elements are on each surface will tell you if the failure is at the interface or within one of the layers.
Assuming the failure is at the interface there are several possibilities.
From your description of the position and shape of the area of failure I would agree that it looks as if it is a failure related to the geometry within the vacuum coating system and not a contamination that has been brought into the system on the film.
There are several possibilities. You mention using a plasma clean. This may not be optimised. The plasma density will be affected by the pressure and positioning of the film within the plasma. The ideal would be to have a regular shaped plasma that all the film sees uniformly for an equal amount of time. Your geometry does not lend itself to this. There can be problems with plasma cleaning. Because some plasma treatment is good thee is temptation to think that more will be better. This is not always true. The plasma treatment can remove any low molecular weight contamination (assuming there is some oxygen gas available) and may also do some chain scission to enable direct metal bonding to the polymer. How ever if the plasma treatment does not contain any oxygen the organics may not be removed and the chain scission may be too great creating a powdery surface, that is often referred to as a weak boundary layer, which will fail. If the surface energy is plotted the surface energy will increase with an increase in plasma treatment time up to a plateau and beyond this time the surface energy will remain constant for some time before it finally declines. If the adhesion is measured this is not the same, the adhesion will initially rise but as the surface energy reaches the plateau the adhesion will only peak and then decline even though the surface energy remains high.
Thus optimising the plasma treatment needs to be done but if there is a difficult geometry then this may be hard to do for the whole surface.
Oil contamination.
It is possible to get oil backstreaming from roughing pumps as well as from diffusion pumps. It is not good policy to run pumps at the low end of their pressure range for long periods of time.
There are two aspects to pumping down a vacuum chamber, one is to reduce the system contaminants and the other is to produce a low pressure to give a long mean free path so that the evaporating material is not scattered between leaving the deposition source and reaching the substrate.
The main contamination for any vacuum system tends to be water vapour that is absorbed on the surfaces and which takes some time to desorb. Often systems are pumped to try to achieve a very low base pressure in the belief that this is the best way of removing the moisture. This is not so. Most water is removed by gas bombardment of the surfaces and so as the pressure falls the amount of gas is reduced and so the number of collisions with the surfaces goes down and the effective rate of removing the water also falls. Thus it is better to add a dry gas during the pumpdown to increase this surface bombardment, which would be seen as limiting the pressure the system is pumped down to. Also adding some other energy can be beneficial in removing the moisture. This can be as simple as using a UV lamp or by using a plasma which also has a very high UV content.
Thus I would review how you pump the system down and where you have the crossover points for changing from roughing to pumping with the diffusion pump. If you look to the semiconductor industry they have also looked at the problem of pumping and contamination. They use this higher pressure type of operation and get cleaner coatings than when they try to pump directly to a very low base pressure.
A simple test to see if you are getting backstreaming is to add to the system a cooled plate where the adhesion to the substrate is poor. With this cooled plate installed, run the process but without igniting the plasma cleaning and without depositing the aluminium. So the plate is pumped for the same lengths of time as the substrate would normally see. When the system is vented check the surface of the plate for any oil contamination. If there is any oil contamination you may need to repeat the process just as far as the end of the plasma clean time, but again without the plasma, just as a method of checking to see if it is the roughing line that is backstreaming or the diffusion pump that is causing the problem.
If it is the roughing pump then you need to revise the pressure and how you achieve the plasma cleaning. Either you need to switch to the diffusion pump and use an input gas to provide the correct operational pressure or you need to increase the roughing pump gas load to reduce the backstreaming or you need to consider adding a cooled baffle into t he pumping throat to collect the backstreaming oil. These cooled are commonly used but be aware that adding one will constrict the pumping area and so the pumpdown time will be much longer and also it does not stop the backstreaming but only limits the amount of oil that gets past the baffle.
I hope this gives you something to try to solve the problem. Please let me know when you have some success. It is always difficult for me to judge if the suggestions I have made are relevant or not and it is only if people let me know afterwards that I can judge if I have helped or not.
Recent Comments