Currently we are trying to coat a PC film by PVD process. We do RF plasma before coating. But, still have delamination problem. Currently the coating process is :-
1. RF plasma.
2. coated with pure Chromium. (ratio : 30%)
3. Then coated with pure aluminium.(ratio:70%)
The reason of choosing chromium and aluminium are due to the mirror appearance effect.
I would like to try below combination:-
1. 1st by aluminium then follow by chromium.
2. 1st by tin then follow by aluminium.
From your expert point of view, do you think which way should be the best way?
Among Cr, Al, Sn, which one have higher surface energy? Does higher surface energy imply to better adhesion to PC film?
Looking forward for your kind answer.
ANSWER
With plasma treatment it is possible to treat the polymer and make the adhesion worse than without treating the surface if the plasma treatment is not done well. When plasma treating the surface there are two main mechanisms that you are looking to achieve, one is to remove any loose, or low molecular weight material from the surface, secondly is to break some bonds and provide more anchor points for the coating to stick. If you are using an argon plasma this can break bonds but cannot remove any carbon based contamination from the surface. It may sputter off some carbon but it will most likely end up back on the surface and still be a problem to good adhesion. It is best to use an oxygen containing plasma. This causes the oxygen to combine with any carbon into a volatile species, which can then be pumped away.
The time of plasma treatment is important and needs to be optimised. Too little time or too much time will not produce the best adhesion. To much time will cause too much chain scission and produce smaller and smaller polymer chains and this will tend towards a weak boundary layer which will be seen as a decrease in adhesion over the optimum.
The method of testing the optimum time is to test the surface energy of the polymer. As the time is increased the surface energy increases up to a point where the surface energy plateaus. If one plots the adhesion strength this too will increase as the surface energy does until the surface energy reaches the plateau where the adhesion only reaches a peak and then immediately starts to fall. Hence the aim is to just reach the peak of surface energy but not to add some extra time.
I am most familiar with roll-to-roll coating systems where the time available for plasma treatment is low. These systems use most often use a DC plasma and these may be magnetically enhanced to increase the plasma density so that the plasma treatment can be achieved within a second.
Increasing the substrate surface energy improves the wetting of the depositing metal. If you imagine the nuclei as growing as hemispheres on the untreated surface then as the surface energy increases the nuclei flatten, increasing in diameter and reducing in height. This means the coatings become continuous at a lower thickness and are more likely to be smoother and conformal.
The chromium is generally used as seed layer. Normally it is expected that the seed layer will nucleate more readily and increase the number of nucleation sites as well as being better anchored to the surface. To do this seed layers are often only ~2nm in thickness. It is not expected that the coating will be produced as a continuous layer and the effectiveness of the seed layer can be less if the thickness is too high.
The brightness of any mirror depends on two things, the perfection of the surface and the quality of the material that is deposited. The substrate should be smooth and flat. The coating should be conformal and the crystal structure should be such that it remains equally as smooth on the surface. The quality of the vacuum and the deposition rate play a part. The faster the deposition rate the smaller the crystal size and, more importantly, the cleaner the coating. All vacuum systems have some background contamination, usually water vapour from outgassing of the system walls, and this will be bombarding the substrate. Typically at aluminium metallizing rates the contamination will arrive at the substrate at around 1 monolayer pre second and at typical deposition rates there will be 1-2% oxygen contamination from the residual water vapour in the system. This will still appear as a bright mirror surface. Where things can go wrong is that if the deposition rate is slowed down the contamination rate will increase. If the vacuum is poor and the rate is low this can result in a change in the coating growth and the inclusion of more oxygen can reduce the mirror performance. In the worst case this can result in the surface of the coating becoming milky, or dull in appearance, or even yellowish. This can be because he coating is more porous, or the crystal size has increased making the surface much more rough, or because the aluminium has been converted to aluminium oxide and there is an interference layer appearing giving the yellow colour. The crystal size will increase with thickness too and so the aim should always be to produce the best coating at the minimum thickness.
Where the ultimate brightness mirrors are required it is common to deposit silver. As this can be corroded easily a silica layer often protects it. The silica is also used as an antireflection coating to further enhance the reflectance. It would be possible to improve the aluminium reflectivity using a silica antireflection coating too.
If I were starting I would start from the beginning and try to optimise the plasma treatment and deposit only aluminium without any seed layer. Once the plasma treatment was optimised I would deposit the aluminium at the fastest possible speed to just above the minimum thickness that would achieve the desired reflectivity. In doing this I would also check on the performance of the vacuum system that the deposition conditions were consistent with delivering a high quality coating.
It would be only if I could not achieve the desired adhesion and/or reflectivity that I would look to using a seed layer.
If I needed to use a seed layer I would still aim for the optimised plasma treatment and aim for the minimum thickness of seed layer.
Offhand I do not know the respective energies of the metals Al, Sn, Cr. I would have to search through some books and papers to not only check the respective energies but also to check if they form alloys and look at the electrochemistry to see if they are likely to have an affinity to form a strong bond. Hence I cannot comment which system would be preferable. However I think that there you may not need to use a seed layer.
I hope this help even if it does not quite answer your question directly.
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