Question.
I represent a converter who is trying to achieve good barrier properties (wvtr<0.2, otr<0.5) using metallized pet as part of the laminate. We have our own metallizer and the highest OD we can achieve on a single pass is 3.0. However, at this OD, we are unable to achieve the above noted barrier properties. Are there other methodologies that are available to enable to hit these properties? We have heard of double side metallized films utilizing plasma and chemical treating? Are these possible solutions and have you had experience with these types of films. Secondly, we are also concerned with loss of properties with downstream processing like rewinding and slitting. Are there special processing requirements for finished metallized film in order not to degrade the barriers achieved during metallizing?
Answer
The biggest limitation to producing good barrier films is generally pinholes.
Pinholes are produced primarily by debris that remains on the film surface that is larger than the very thin metal coating you deposit so that after metallization if the debris is moved it leaves behind a pinhole.
A second source of pinholes is spitting from the boat. This can be caused by a combination of reasons such as a low purity aluminium wire or the wire having a thick oxide coating on as well as an unstable pool of molten metal that as the pool size changes encourages spitting from the ends of the collection of crud built up from the wire oxide and impurities.
Another source of pinholes is any pickoff. This is where any high spots on the reverse surface presses hard against the freshly deposited metal and in some cases it overcomes the adhesion and picks off the metal from one surface and it transfers to the second surface. Again leaving a pinhole. Typically this is associated with large fillers and a hard wound roll.
If the incoming roll is cleaned to a high standard it is possible to reduce the number of pinholes and so improve the barrier performance.
This can be done by using techniques such as the tacky roll type method of removing debris. All polymer film will be covered with debris. This is partly because the polymer film, as it is wound, generates an electrostatic charge that attracts airborne debris to the surface. This can include slitter dust. Thus if the roll is cleaned just before the final rewind before the roll then goes into the vacuum system this can help. If it is done earlier it can become recontaminated very easily. Ideally after cleaning the film should be in under a clean filtered air hood to limit recontamination. Also the film should be cleaned on both sides otherwise the debris from the back surface can become transferred onto the front surface as the film is rewound.
Similarly it may be possible to improve the wire purity and make sure the wire surface has a minimum of oxide present and may also be possible to improve the wire feed control to reduce some of the pool variations. This will help reduce any spitting problems
Other possible things that can be looked at is to see if it is possible to wind the material between metallization and lamination with fewer or no front surface rolls in order to minimise the change of moving the debris and so limiting the number of pinholes that appear. Although it is better to clean the material and not have the debris present but this may not be easy to accomplish.
The use of adhesion promoting measures, such as plasma pre-treatment, if done well with the process carefully optimised, can improve the adhesion as well as the metal wetting. This has two advantages. The improved wetting means that the metal will spread out on the surface and so will produce a continuous coating at a reduced thickness and this can be seen as either the same OD at a thinner coating thickness or for the same thickness a higher OD. The second advantage is that the coating is less likely to have problems with pick off as a method of producing pinholes.
In addition there may be other changes that can show benefits. If the metallized film is laminated very soon after metallization it may lose more barrier performance compared to if any further processing were to be delayed by a day or more. The aluminium coating is very soft and is more prone to damage if it is handled very soon after metallization. If the roll is stored for a short period of time the native aluminium oxide is allowed to build up on the surface of the aluminium and this is much stranger and any damage is likely to be less.
Where double side metallization wins is that there statistically it is unlikely that any of the pinholes on each of the two aluminium coatings lines up with each other and so the increased tortuous path reduces the gas or moisture transmission.
I hope this gives you some explanation about where the lack of barrier comes from and some possible routes forward.
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