Question re. Lamination bond strength.
One more question to you that is we are facing problem of less bond strength especially when the metalized film is laminated to other substrates. So to get more bond strength what we have do please advise and if it is not possible please tell us that why we cannot get good bond strength.
Answer
The bond strength after metalization can be time dependent.
It may also be dependent upon the substrate and processing.
Assuming you are referring to BOPP as per the previous questions.
Often BOPP contains additives such as slip agents that are added to the bulk polymer and which are designed to migrate from the bulk t the surface. These slip agents help make the polymer film more easily handled on winding and packaging machines by lowering the coefficient of friction. Unfortunately this reduction in coefficient of friction generally means the surface energy is reduced and this reduces the metal adhesion. To combat this reduction in adhesion it is common to use flame, corona or atmospheric plasma treatments or vacuum plasma treatment to increase the surface energy to improve the adhesion and wetting of the aluminium.
The additives do not discriminate between surfaces but migrate to both surfaces equally. Thus when the metallized film is re-wound the freshly metallized surface will be brought into contact with the back surface of the film that has the low surface energy slip agent present. The freshly metallized surface has a very high surface energy. It is the nature of things that surfaces try to reach equilibrium at the lowest surface energy state. Hence there is a high driving force for the low surface energy slip agent to migrate from the back surface onto the freshly metallized surface. Thus reducing the surface energy and in so doing reducing the adhesion of any subsequent coating or laminate. The longer the time and the higher the temperature between metalization and subsequent process the more material will have been transferred and the lower the surface energy and so the expectation of adhesion should also be lower.
It may be worth reviewing you process to see if you have a consistent time between metalization and lamination. Also, if you are storing the rolls of film, review if the time, temperature and humidity are controlled. It would also be worth checking the surface energy of the film both immediately after metalization and then over time to monitor the progression of reduction of surface energy.
Assuming the above explanation allies to your situation then what you can do to rectify the problem would be to laminate as soon after metalization as possible. In this way you can minimise the time available for any low molecular weight material to migrate across to the metal layer. This may still not be acceptable as it is also common for film to be wound in vacuum systems still warm (well above ambient temperature) and so there may still be enough time for material to migrate. If there is still a concern over adhesion then it is always possible to treat the metal surface immediately before lamination. Using either a corona or atmospheric plasma it is possible to clean the metal surface and raise the surface energy to increase the wetting and adhesion of the laminate.
I hope this explains what might be happening to your film.


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